Introduction
As a Hardware Developer at IBM, you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.

Your Role and Responsibilities
We are seeking an engineer for the Defect Inspection and Yield Characterization team to drive defect inspection strategy and yield improvement for Chiplet and Advanced Packaging programs. The engineer will be responsible for creating defect inspections and providing data analysis to find key yield issues, identify root cause, and drive issues to resolution. This role will involve evaluating and implementing new inspection tools and capabilities. The engineer will work with equipment vendors, as well as IBM integration and process teams, to identify areas for collaboration and inspection optimization.

Required Technical and Professional Expertise
• Experience in Microelectronics field (2+ years)
• Ability to independently troubleshoot and solve complex problems
• Experience with data analysis and presenting to technical audience
• Demonstrated understanding of Yield Characterization
• Understanding of optical and eBeam inspection techniques

Preferred Technical and Professional Expertise
• Experience in Far Back End of Line (FBEOL) / 3D Integration / Chip Packaging (2+ years)
• Experience with data analysis and presenting to technical audience (2+ years)
• Experience using optical and eBeam inspection equipment (2+ years)